LCY has developed dedicated resin and liquid rubbers for high-speed copper-clad laminates (CCL) to meet the growing high-speed demands of AI, HPC, data centers, and 5G systems. Featuring ultra-low dielectric loss, enhanced thermal stability, and strong peel strength, LCY’s advanced hydrocarbon polymer series is engineered for high-speed transmission, improved thermal management, and assembly reliability—making them critical materials for next-generation AI servers, data centers, and automotive electronic systems.
LCY Ultra Low Loss Resin and Rubbers for High-speed CCL
High Thermal Stability and Low Deformation: Critical Materials for Next-Gen High-Speed Substrates
LCY’s unique resin and rubbers provide excellent high-temperature stability for reliable assembly and long-term operation. High solubility, uniform formation, and processing flexibility enable seamless integration into existing manufacturing processes, while improved CTE performance maintains structural integrity through repeated thermal cycles, minimizing warpage and deformation.
Engineered for High-Load Applications
Leveraging advanced materials science, LCY’s solutions support high-speed computing and next-generation automotive electronics. These materials are designed for applications that require exceptional stability, such as AI servers, data center switches, high-frequency base stations, advanced driver-assistance systems (ADAS), and autonomous platforms. They deliver reliable, robust, and competitive solutions for high-speed data processing and smart mobility.
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