LCY has developed dedicated resin and liquid rubbers for high-speed copper-clad laminates (CCL) to meet the growing high-speed demands of AI, HPC, data centers, and 5G systems. Featuring ultra-low dielectric loss, enhanced thermal stability, and strong peel strength, LCY’s advanced hydrocarbon polymer series is engineered for high-speed transmission, improved thermal management, and assembly reliability—making them critical materials for next-generation AI servers, data centers, and automotive electronic systems.
LCY Ultra Low Loss Resin and Rubbers for High-speed CCL
High Thermal Stability and Low Deformation: Critical Materials for Next-Gen High-Speed Substrates
LCY’s unique resin and rubbers provide excellent high-temperature stability for reliable assembly and long-term operation. High solubility, uniform formation, and processing flexibility enable seamless integration into existing manufacturing processes, while improved CTE performance maintains structural integrity through repeated thermal cycles, minimizing warpage and deformation.
Engineered for High-Load Applications
Leveraging advanced materials science, LCY’s solutions support high-speed computing and next-generation automotive electronics. These materials are designed for applications that require exceptional stability, such as AI servers, data center switches, high-frequency base stations, advanced driver-assistance systems (ADAS), and autonomous platforms. They deliver reliable, robust, and competitive solutions for high-speed data processing and smart mobility.
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Frequently Asked Questions
What are the core advantages of your high‑speed materials?
Our high‑speed materials feature a low‑Df design that effectively reduces high‑speed signal loss while maintaining processability. They can be integrated into existing PCB manufacturing processes, support high‑layer‑count designs, and meet the requirements of AI servers.
Do you provide customized technical support?
Yes. Based on the customer’s product design direction and application needs, we offer customized technical support services, including electrical testing and analytical data under customer‑specified conditions, as well as application recommendations and design discussions tailored to actual material requirements.
Which solvents can be used to dissolve resin or rubber materials?
Toluene, MEK (Methyl Ethyl Ketone), THF (Tetrahydrofuran), and Cyclohexane can be used. The actual choice of solvent may be adjusted based on formulation design and process requirements.
What is the curing reaction temperature range for resin or rubber materials?
According to Differential Scanning Calorimetry (DSC) results, the curing reaction temperature range of the resin or rubber materials is approximately 100°C to 250°C. Reaction conditions can be optimized based on material formulation and process settings.
Do the materials comply with environmental and regulatory requirements?
Yes. Our products comply with major environmental regulations such as RoHS and REACH, and we continuously optimize material formulations and processes to meet evolving market requirements.
