Backed by proven expertise in semiconductor materials, LCY recognizes the pivotal role each cleaning step in advanced packaging plays in yield and chip reliability. Building on this insight, LCY has developed a comprehensive portfolio of wet processing chemicals spanning FEOL, BEOL, and advanced packaging. Powered by proprietary technologies, LCY's solutions deliver unparalleled cleaning performance, high selectivity, and exceptional interface compatibility.
LCY Advanced Wet Chemical Formulation Engineered for Superior Performance
Optimized Efficiency with Low-VOCs for Advanced Processes
LCY Advanced Formulations delivers powerful cleaning performance, high selectivity, and excellent interface compatibility for both etching and cleaning applications in semiconductor manufacturing.
The portfolio enables the selective and thorough removal of residues from laser debonding, temporary bonding/debonding (TBDB), and RIE/ashing processes. It is designed to protect wafers, micro-bumps, and critical metal layers while delivering the surface cleanliness and structural integrity required for advanced packaging.
Featuring a highly controlled etch rate and high selectivity, the formulations minimize undercut while delivering residue-free surfaces that enable reliable downstream processing. They are designed for advanced packaging applications, including wafer-level packaging (WLP), panel-level packaging (PLP), and 2.5D/3D IC integration.
Key Features in Advanced Packaging
- Polysiloxane
- PMMA
- PET
- Epoxy
- Polyimide
- GaAs wafer
- Silicon wafer
- Stainless steel
- Glass substrate
- Non-NMP
- Non-TMAH
- Non-DMSO
Formulated Cleaning Solutions
1. Advanced packaging
Engineered for advanced packaging, the ESV Series delivers robust cleaning performance with excellent interface protection, meeting the demands of complex processes such as TBDB and laser debonding. It is compatible with WLP, PLP, and 2.5D/3D IC architectures. When combined with the SR Series bump etchants, the portfolio provides a comprehensive wet-processing solution that supports the performance and reliability of next-generation high-performance chips.
TBDB removal
- ESV-100 Series
- ESV-300 Series
- ESV-400 Series
Bump etchant
- SR Series
2. FEOL
The LMG Series offers high-selectivity etching, precisely removing target residues without damaging the underlying substrate. It optimizes downstream processes by ensuring a stable, consistent interface quality in the early stages of wafer processing.
Selective etchant
- LMG Series
3. BEOL
Following RIE, ashing, or bulk PR processing, the LTW and LMG Series rapidly remove stubborn residues while preserving the integrity of metal and dielectric layers. This ensures a seamless transition to subsequent advanced packaging processes. Bulk PR and Post RIE／Ash residue removal
- LTW Series
- LMG Series
Integrated Cross-Process Applications
Powered by material innovation and process expertise, LCY delivers wet processing solutions that set new standards for efficiency, reliability, and sustainability in advanced packaging. By partnering closely with leading semiconductor manufacturers worldwide, LCY is shaping the next generation of processes—faster, more precise, and built for a more sustainable future.
Product Specifications
| Grade | Product Line | Product Type | Application Keywords | |
|---|---|---|---|---|
| ESV | Cleaner | TBDB Removal | Wet chemicals, wet cleaner, debonding cleaner, TBDB remover, adhesive layer removal, release layer removal, residue remover, laser debonding residue cleaning, removal of bonding residue in advanced semiconductor packaging processes and heterogeneous integration processes such as FOWLP, FOPLP, TSV, CoWoS, power chips, and HBM | Ask for sampleFiles download |
| IBC | Cleaner | Flux Cleaner | Wet chemicals, wet cleaner, flux remover, flux cleaner, defluxing agent, solder residue remover, removal of bonding residue in advanced packaging and heterogeneous integration processes, including FOWLP, FOPLP, TSV, SoIC, power chips, and HBM | Ask for sampleFiles download |
| LTW | Cleaner | Ash Residue Removal | Wet chemicals, Wet cleaner, Photoresist stripper, PR stripper, and Post-etch residue remover | Ask for sampleFiles download |
| SR | Etchant | Bump Etchant | Etch micro-bumps in Fan-Out, 2.5D, and 3D ICs to control their dimensions and ensure precise stacked interconnects. | Ask for sampleFiles download |
| LMG | Etchant | Selective Etchant | Polysilicon etchant and Poly-Si etchant | Ask for sampleFiles download |
