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High-Precision Formulations, Advanced Hydrocarbon Polymers, and Colorless Polyimide (CPI)

Comprehensive Solutions for the Semiconductor, AI, High-Speed Communications, and Next-Generation Display Applications

TAIPEI, Sep. 10, 2025 -- As the global semiconductor industry enters a new era defined by AI and HPC (high performance computing), there is an increasing demand for materials that deliver higher performance, enhanced safety, and greater sustainability to support the technological advancement in advanced packaging, an enabler for AI and HPC. Given the unprecedented increase in demand for high-purity, application-specific, and scalable materials for advanced packaging applications, the role of wet processing formulation has become more crucial. LCY Chemical Corp. (LCY) today announced the launch of LCY Advanced Formulations, highlighting the key technologies and sustainability strengths that will be showcased at the SEMICON 2025 Heterogeneous Integration Global Summit (HIGS). Tailored for high-integration, high-precision advanced packaging, LCY Advanced Formulations provides superior performance for a wide range of applications, high throughput, low chemical consumption that lowers the total cost of ownership, and are designed with sustainability in mind using greener chemistry and environmental benign solvents. These advantages deliver the critical solution global customers need to ensure process reliability and stability, while supporting the continued expansion of worldwide semiconductor manufacturing capacity.

The semiconductor industry has entered an era of ultra-precision, in which cleaning agents have shifted from supporting roles to critical factors in yield and process performance. Drawing from proven expertise in the R&D, stable supply, and closed-loop recycling of electronic-grade isopropyl alcohol (EIPA), LCY is introducing LCY Advanced Formulations—a next-generation portfolio of wet processing chemicals designed for advanced semiconductor manufacturing. LCY Advanced Formulations offers three key strengths: manufacturing expertise in electronic materials, tailored solutions to meet customer’s performance, yield and cost targets, , and sustainability development aligned with customers’ ESG goals. With a global manufacturing footprint and R&D presence, LCY strengthens the resilience of the supply chain by integrating R&D, application testing, and mass production support. Looking ahead, LCY will collaborate with customers to drive innovation at the forefront of semiconductor manufacturing by delivering ultra-clean, highly stable process materials that will elevate supply chain competitiveness to the next level.

LCY's newly launched Advanced Formulations supports a wide range of applications, including wafer and post-packaging cleaning. These formulations are designed for exceptional performance, selectivity, and process compatibility to effectively address the precise cleaning requirements of advanced semiconductor processes. 

Dr. Yu-Ling (Elaine) Hsiao, Chief Technology Officer of LCY Chemical Corp. noted: "In developing the portfolio of advanced formulations, we focused on precise selectivity, high efficiency, operational safety, and sustainability. Each solution is finely tuned to the customer's new process and architectures. With this next-generation Advanced Formulations, we enable advanced packaging and wafer-level processes to achieve high reliability and greater flexibility across diverse applications, meeting critical needs in cleaning, stripping, and etching. We are equipping advanced packaging plants and semiconductor foundries to confidently meet the challenges of the next era.” More product insights will be shared at HIGS during SEMICON 2025.

LCY is also expanding its electronic materials portfolio with colorless polyimide (CPI) and advanced hydrocarbon polymers, designed to support next-generation applications in display technologies, AI, and high-performance computing. CPI meets the demands of advanced displays, in-vehicle screens, and foldable consumer devices with high mechanical strength, flexibility, excellent heat resistance, optical transparency, and low-loss optical delay. It also aligns with global regulatory and sustainability trends toward fluorine-free materials. Due to its properties, CPI has the potential to replace glass cover plates in large-size flexible electronics. 

Meanwhile, the advanced hydrocarbon polymer series is engineered for high-speed copper-clad laminates (CCL); the portfolio includes liquid rubbers and ultra-low dielectric loss hydrocarbon resin polymers. These materials are widely applicable in AI processors, self-driving vehicles, servers, and data centers, offering low dielectric loss, superior thermal stability, high solubility, and outstanding toughness. Together, these properties enable the reliable high-speed data transmission demanded by next-generation technologies.

At the same time, LCY is actively delivering on its ESG commitments. The company was honored with the 2024 TSMC Excellent Performance Award – Excellent Contribution in Green Manufacturing. LCY also received the highest “A” rating in the 2024 CDP Supplier Engagement Leader assessment. LCY has set a clear target to reduce company-wide carbon emissions by 42% by 2030. LCY's Electronics Materials Business Unit is committed to transitioning its Linyuan and CTSP Plants in Taiwan to 85% renewable energy by 2030, while the plants in China are targeted to achieve 100% renewable energy within the same timeframe, marking steady progress toward LCY's 2050 net-zero vision.

According to a market research report by Knowledge Sourcing Intelligence1, demand for high-purity and precision cleaning agents is accelerating, driven by advanced packaging technologies such as 3D IC, fan-out packaging, and system-in-package (SiP). The wet processing formulation market is growing rapidly and is projected to expand from US$2.99 billion in 2025 to US$4.1 billion by 2030. As AI applications accelerate, LCY will continue to invest in solutions that address the evolving needs in advanced packaging and high speed communication applications. . LCY will also strengthen its strategic collaborations with wafer foundries, outsourced semiconductor assembly and test (OSAT) providers, and equipment manufacturers. LCY aims to expand its global presence and solidify its position as a trusted partner in advanced processes and electronic materials. LCY is at the forefront of innovation, helping customers capitalize on opportunities arising from technology node transformation.