Materials Tech Pulse

As AI, high-performance computing, chiplets, and advanced packaging technologies continue to advance rapidly, wafers are trending toward thinner profiles, finer features, and higher-density integration, driving increasingly stringent requirements for process cleanliness and reliability. Whether it is adhesive removal in Temporary Bonding/Debonding (TBDB) processes or the cleaning of flux residues, both have become critical factors affecting product yield and subsequent process steps.

LCY has introduced two wet chemical solutions for advanced packaging processes — DB Remover and Flux Cleaner — designed respectively to improve adhesive removal efficiency after debonding and to enhance flux cleaning performance in fine-pitch structures. With high cleanliness, strong metal compatibility, and an integrated process design, these solutions help customers simplify their processes, reduce costs, and meet the demands of next-generation advanced packaging for high reliability and high-precision processing.

As Advanced Packaging Continues to Scale Down, Traditional Cleaning Processes Face New Reliability Challenges

As Fan-Out, 2.5D/3D packaging, and heterogeneous integration continue to advance, wafers are trending toward thinner and finer designs, raising the bar for in-process cleaning. Whether it is adhesive removal in the Temporary Bonding/Debonding (TBDB) process or post-packaging flux cleaning, both directly affect downstream process quality and product reliability.

In the debonding process, as adhesive materials gain higher heat and chemical resistance, conventional adhesive-removal methods tend to leave residues that affect subsequent processes and can even reduce product reliability and yield. In addition, typical cleaning workflows often require separately treating the release layer and the adhesive layer, which increases process time and raises chemical, equipment, and labor costs.

At the same time, shrinking micro-bump pitches and expanding interposer areas are making flux cleaning increasingly difficult. Conventional cleaning fluids struggle to penetrate fine-pitch gaps and the center regions of large packages; incomplete residue removal can compromise subsequent material adhesion and even reduce component reliability. As a result, the market is calling for cleaning solutions that combine high cleanliness, low corrosivity, and strong penetration capability.

A One-Step Cleaning Solution That Improves Both Adhesive-Removal Efficiency and Fine-Structure Cleanliness

For the debonding process, LCY's DB Remover removes both the release layer and the adhesive layer in a single cleaning step, replacing the conventional two-step process that requires two separate cleaning fluids. This significantly streamlines the workflow and reduces labor, equipment, and chemical costs while shortening overall process time.

In addition, through formulation design, solvent selection, and metal corrosion inhibition technology, LCY maintains strong metal compatibility during high-efficiency adhesive removal, avoiding any impact on device function. Compared with products currently on the market, DB Remover effectively reduces the risk of carbon char redepositing on the wafer surface after laser debonding, and reduces residue adhesion on the tape, improving the stability of downstream processes.

For flux cleaning, LCY optimizes solvent selection and formulation to enhance the wettability and capillary penetration of the cleaning fluid, allowing it to reach micro-bump gaps below 100 μm and the center regions of large interposers, effectively improving flux removal efficiency.

At the same time, LCY adjusts solvent ratios according to flux composition to balance high dissolving power with low metal corrosivity, and uses a metal corrosion inhibition formulation to ensure that key metal structures such as SnAg and copper pillars remain unaffected — meeting the demanding cleanliness and reliability standards of advanced packaging.

DB Remover and Flux Cleaner: Balancing High Cleanliness, Process Integration, and Metal Compatibility

The key feature of LCY DB Remover is its ability to remove both the release layer and the adhesive layer with a single cleaning fluid, eliminating the need to switch chemicals for different materials and effectively reducing process complexity and equipment requirements.

The product also delivers highly reliable cleaning performance, reducing carbon char redeposition on the wafer and the dicing tape, and features a low metal content formulation with green solvents, high volatility, and a more environmentally friendly design. It is also formulated to be free of TMAH and NMP and to avoid REACH compliance issues, reducing chemical usage and carbon footprint while supporting sustainability goals.

Flux Cleaner offers high penetration, high flux-removal efficiency, and excellent metal compatibility, effectively cleaning flux residues from fine-pitch packaging structures with excellent SnAg and Cu compatibility. Combined with LCY's high-purity solvent manufacturing and localized production capabilities, Flux Cleaner delivers electronic-grade, high-specification cleaning products that help customers improve overall process quality and reliability.

Streamlining the Cleaning Process to Improve Cleanliness and Process Integration

Customers have widely recognized the products' performance in high cleanliness and metal compatibility, noting that the single-fluid design effectively simplifies the debonding process and reduces the need for process switching, labor input, and equipment setup.

Compared with conventional cleaning methods, DB Remover helps customers eliminate one process step, lowering chemical, labor, and equipment costs while improving process integration efficiency. Flux Cleaner, meanwhile, addresses increasingly fine-pitch packaging structures by improving cleaning performance in narrow regions, helping customers meet the challenges of next-generation advanced packaging processes.

Application Scenarios

●    Fan-Out packaging (FOWLP)

●    2.5D/3D packaging

●    CoWoS

●    SoIC

●    EMIB

●    Panel-level packaging (FOPLP)

●    System-in-Package (SiP)

●    Heterogeneous integration

●    Micro LED and mass transfer processes

●    Glass carrier cleaning and reclamation

High-Cleanliness Wet Chemical Solutions Supporting Advanced Packaging Toward Higher Reliability

As advanced packaging technology continues to move toward finer geometries, higher density, and heterogeneous integration, the cleaning process has become more than just residue removal — it is now a critical factor affecting product yield, reliability, and overall process efficiency. Through its DB Remover and Flux Cleaner wet chemical solutions, LCY balances high cleanliness, metal compatibility, and process integration capability, helping customers reduce process complexity and meet the high-precision cleaning demands of next-generation advanced packaging.

Looking ahead, LCY will continue to collaborate with customers to develop additional wet chemical products and end-to-end process solutions for next-generation packaging technologies such as FOPLP, glass substrates, TGV, CPO, and hybrid bonding, helping customers meet the new challenges of advanced semiconductor processes.

If you are looking for an advanced packaging cleaning solution that combines high cleanliness, low corrosivity, and process integration capability, we invite you to contact LCY to jointly build wet chemical solutions with greater efficiency and reliability.

For more product information or technical collaboration inquiries, please visit: https://www.lcycic.com/en/contact-us